X-ray inspections are one of the best solutions for not only finding and analyzing defects within your assembly in a non-destructive manner, but to have peace of mind that your application is sound from errors earlier in the manufacturing process.
Offering real-time 2D and 3D digital x-ray inspection services for PCB components, assemblies, and other electronic devices.
Providing this serviceÂ along with a trained and certified process engineer on-site at our faculty with your resources. We also provide remote inspections using our real-time conferencing system for an interactive experience.
X-Ray Inspection Overview
X-ray inspections offer electronic manufacturers and assemblers a way to inspect defects within their products. Easily in a non-destructive manner, in locations that are hidden or impossible to inspect optically.
With this being said x-ray inspections become an important method of validating production processes earlier on before a later stage in the manufacturing timeline. Which can lead to increased cost and loss of time and resources.
Common X-ray Inspection Defects
There are a lot common defects and faults that can come into account during the manufacturing and assembly process of electronic devices.
- BGA Voiding
- Wicking of BGA Solder Balls
- BGA Pop Corning / Cracking
- Missing Solder Balls
- Incomplete Reflow
- Misalignment of BGA Package
- Solder Shorts/Bridges
- Flip Chip Open Circuit
- Joint Voiding
- Through Hole Incomplete Fill
- Cracks & Breaks in Tracks, Joints, & Components
Ball Grid Arrays are a widely used component in the electronic manufacturing industry due to its small size. With these high-density components, defects occur where visual inspection can be impossible, and destructive testing will compromise voiding defects.
X-Ray Inspection Service Request
Please complete the form belowÂ to request an x-ray inspection. Give us a call at 1.800.344.4685 to speak with one of our specialists for more information about our capabilities and reoccurring pricing.