X-ray inspections are one of the best solutions for not only finding and analyzing defects within your assembly in a non-destructive manner, but to have peace of mind that your application is sound from errors earlier in the manufacturing process.
X-Ray Inspection Overview
X-ray inspections offer electronic manufacturers and assemblers a way to inspect defects within their products in a non-destructive manner, in locations that are hidden or impossible to inspect optically.
Additionally, x-ray inspections can aid in validating production processes earlier on in the manufacturing timeline rather than in the later stages, where increased costs and loss of time and resources could becom detrimental.
Common X-ray Inspection Defects
There are several common defects and faults that can arise during the manufacturing and assembly processes of electronic devices, such as:
- BGA Voiding
- Wicking of BGA Solder Balls
- BGA Pop Corning / Cracking
- Missing Solder Balls
- Incomplete Reflow
- Misalignment of BGA Package
- Solder Shorts/Bridges
- Flip Chip Open Circuit
- Joint Voiding
- Through Hole Incomplete Fill
- Cracks & Breaks in Tracks, Joints, & Components
Ball Grid Arrays are a widely used component in the electronic manufacturing industry due to its small size. With these high-density components, defects occur where visual inspection can be impossible, and destructive testing will compromise voiding defects.
X-Ray Inspection Service Request
Please complete the form below to request an x-ray inspection. Give us a call at 1.800.344.4685 to speak with one of our specialists for more information about our capabilities and reoccurring pricing.