Detect Potential Defects Before it’s too Late

X-ray inspections are one of the best solutions for not only finding and analyzing defects within your assembly in a non-destructive manner, but to have peace of mind that your application is sound from errors earlier in the manufacturing process.

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Minimize Common BGA Voiding Errors

Ball Grid Arrays are a widely used component in the electronic manufacturing industry due to its small size. With these high-density components, defects occur where visual inspection can be impossible, and destructive testing will compromise voiding defects.

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