Potential Defects Could Cost You
X-ray inspections are one of the best solutions for not only finding and analyzing defects within your assembly in a non-destructive manner, but to have peace of mind that your application is sound from errors earlier in the manufacturing process. Finding errors in your assembly at a later stage of production can cost you dearly in time and resources.
Here at PICA we recently had a customer come to us to verify errors that could possibly arise and cause problems in their sensor due to potential solder defects and soldering wetting.
Verification of solder joints in 5 sample applications.
Inspect for solder defects and proper solder wetting within the provided 5 samples.
Highlight any other features of interest.
X-rayed the provided 5 samples and took pictures at all angles to show solder deposition and solder wetting to the wire.
Provided customer with photos at 0 degrees, 90 degrees, and included oblique angles with detector tilted.
After going through all five samples no visible solder defects were present. Between all five samples there were very small inconsistencies in the size of the solder fillets due to the process of manually soldering these. No visible wetting problems or any cracks in the solder joints. They were all very similar and no defects presented themselves under x-ray at max magnification.
For more information on x-ray inspection services or to schedule a x-ray inspection visit www.pcbxrayinspection.com or contact PICA X-ray Inspection Services at 1.800.344.4685 to speak with an x-ray inspection technician.