4 Common Manufacturing Errors that could be Affecting your Assembly Process
Ball Grid Arrays or BGA for short are a widely used component in the electronic manufacturing industry due to its small size. With these high-density components, defects occur where visual inspection can be impossible, and destructive testing will compromise voiding defects.
This is where x-ray inspections can be a great resource to inspect possible voiding issues in the BGA component assembly processes, in a non-destructive testing manner. Once the BGA components have been inspected and analyzed for any voiding issues, consult the manufacturing process for common errors that could potentially cause any voiding issues.
Voiding in Ball Grid Arrays can occur during many stages of manufacturing. Most issues that can cause voiding can easily be adjusted to minimizing voiding in the assembly process.
Solder Paste Handling
Improper Solder Paste handling and storage can lead to voiding right out of the gate. Storing solder paste properly can dramatically decrease any voiding issues that may occur. Consult your solder paste manufactures datasheet. Most manufacturers will have you store paste in a refrigerator when not in use.
Solder paste must be warmed up to room temperature before using. Do so by letting the paste sit for a certain amount of time to reach proper temperature.
Most importantly make sure solder paste that is being used has not expired.
Reflow Time and Ramp Rate
The most important process parameter for voiding is the oven profile. An oven profile is the set of temperatures in each of the reflow ovens heated zones. Paste manufacturers provide a datasheet for their solder paste. These datasheets show a thermal profile line graph with the target parameters to reach a proper reflow of the paste.
By adhering to the reflow ramp rate specified by the solder paste manufacturer this ensure that the components solder has enough time for outgassing. This process allows the solder pastes to release any flex particles or gases during the melting process.
If not properly followed this could potentially leave voiding in any final solder joints.
Voiding can also occur at the component manufacturing level. Which can be inspected by x-ray before the circuit board assembly begins if defects are occurring after all other factors have been eliminated during the assembly process.
Circuit Board and Component Contaminant
Make sure all circuit boards and components are properly stored in air tight clean containers to avoid risk of contamination. This will prevent moisture, dust, oils, and other elements from potentially damaging or oxidizing solder pads.
Leave all circuit boards and components in their proper containers until the assembly process.
There are many other factors that can come into play that can potentially cause voiding in BGA components. These are just a few of the most common voiding parameters that can occur during the manufacturing and assembly process.
For more information on x-ray inspection services or to schedule a BGA x-ray inspection visit www.pcbxrayinspection.com or contact PICA X-ray Inspection Services at 1.800.344.4685 to speak with an x-ray inspection technician.